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BGA1
- 本应用指南针对 FT256 1 mm BGA 封装的 Spartan™ -3E FPGA，讨论了低成本、四至六层、 大批量印刷电路板 (PCB) 的布局问题，同时探讨高速信号和信号完整性 (SI) 因素对低层数 PCB 布局的影响。-Application Guide for the FT256 1 mm BGA package, Spartan ™-3E FPGA, the discussion of the low-cost, four to six, high-
fengzhuang_BGA
- BGA的封装，ALTIUM DESIGNER 09-BGA package, ALTIUM DESIGNER 09
BGA_thermal_
- ANSYS环境下（APDL语言）用于仿真计算BGA封装的散热性能-Wrote by APDL language, it could be used for the simulation of the thermal performance of the BGA package in ANSYS environment
bsdl
- badl file source code,用于在Basic语言环境下测试BGA
1500w烤箱回流焊
- 1500w烤箱回流焊 源程序 电路图 BGA返修台(Circuit diagram of reflow soldering source program for 1500W oven)